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ULTRA FAST RECOVERY POWER RECTIFIER
1N6626D3A / 1N6626D3B
* * * High Reliability Screening Options Available High forward current surge current capability Switching power supplies or other applications requiring fast switching and low forward loss
ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise stated)
VRWM IO1 IFSM2 TJ Tstg TSP Working Peak Reverse Voltage Average Rectified Forward Current TA = 25C Peak Forward Current Surge Junction Temperature Range Storage Temperature Range Maximum Soldering Pad Temperature for 20s 200V 1.75A 75A -65 to +175C -65 to +175C 260C
THERMAL PROPERTIES
Symbols
RJSP(IN) RJA(PCB)
(3)
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25C Thermal Resistance, Junction To Ambient, On PCB Thermal Resistance, Junction To Ambient, On PCB
Max.
40 72.5 110
Units
C/W C/W C/W
RJA(PCB)(4)
Notes (1) IO1 is rated at 1.75A @ TA = 25C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(Max) does not exceed 175C; This equates to RJA(PCB) 85C/W. (2) TA = 25C @ IO=0A and VRWM = 0V for ten 8.3mS surges at 1 minute intervals. (3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0" x 1.0"), (645mm x 645mm) , horizontal in still air. (4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070" x 0.155"), (1.78mm x 3.94mm) , horizontal in still air. IO1 is rated at 1.5A @ TA = 25C for PC boards where RJA(PCB) 111C/W. Derate at 10mA/C above TA = 25C in this case.
Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing an order. Semelab ltd Telephone +44 (0) 1455 556565 Email: sales@semelab-tt.com Coventry Road, Lutterworth, Leicestershire, LE17 4JB Fax +44 (0) 1455 552612 Website: http://www.semelab-tt.com Document Number 8975 Issue 2 Page 1 of 4
ULTRA FAST RECOVERY POWER RECTIFIER
1N6626D3A / 1N6626D3B
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise stated)
Symbol
VF
3
Parameters
Diode Forward Voltage
Test Conditions
IF = 4A IF = 2A TA = -65C
Min.
Typ.
Max.
1.5 1.35 1.65 2.0
Unit
V
IR
3
Reverse Current Leakage
VR = 200V
TA = 25C TA = 150C
A 500 220 V
VBR
3
Breakdown Voltage
IR = 50A TA = -65C
200
DYNAMIC CHARACTERISTICS
CT trr1
4
Capacitance Low Current Reverse Recovery Time Forward Recovery Voltage
VR = 10V
f = 1.0MHz 30
40
pF ns
IF = 0.5A, IRM = 1.0A, IR(REC) = 0.25A IF = 1A tr = 12ns
VFRM
8
V
Notes 3 Pulse Width 300us, 2% 4 As per MIL-STD-750 Method 4031 Condition B.
Semelab ltd Telephone +44 (0) 1455 556565 Email: sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB Fax +44 (0) 1455 552612 Website: http://www.semelab-tt.com
Document Number 8975 Issue 2 Page 2 of 4
ULTRA FAST RECOVERY POWER RECTIFIER
1N6626D3A / 1N6626D3B
MECHANICAL DATA
A D
PAD 1 PAD 2 DIMENSION A B C D ANODE CATHODE mm 7.00 0.10 3.75 0.10 1.60 0.10 1.76 0.10 Inches 0.275 0.004 0.143 0.004 0.063 0.004 0.069 0.004
SML D3A
C C
1
2
A
B D
SML D3B
C C
PAD 1 PAD 2 PAD 3 DIMENSION A B C D
ANODE CATHODE LID CONTACT TO CATHODE* mm 7.00 0.10 3.75 0.10 1.60 0.10 1.76 0.10 Inches 0.275 0.004 0.143 0.004 0.063 0.004 0.069 0.004
1
2
3
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/dlcc3.html on the Semelab web site. Package variant to be specified at order. The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology, which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
)
*
A B C mm 7.32 1.78 3.94 Inches 0.288 0.070 0.155
+
B
Soldering temperature should be 260C for a maximum of 10 seconds.
The physical dimensions for the DLCC3 ceramic package are designed to be different from the published dimensions for the "D-5B" and "EMELF" outlines. The DLCC3 design fully utilises the recommended solder footprint for the "D-5B" / "E-MELF" Package, and as such presents a drop in replacement for existing board designs.
PACKAGE MASS Gold Plated Solder Pad Finish = 150mg
Semelab ltd Telephone +44 (0) 1455 556565 Email: sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB Fax +44 (0) 1455 552612 Website: http://www.semelab-tt.com
Document Number 8975 Issue 2 Page 3 of 4
ULTRA FAST RECOVERY POWER RECTIFIER
1N6626D3A / 1N6626D3B
SCREENING OPTIONS
Space Level (JQRS/ESA) and High Reliability options are available in accordance with the High Reliability and Screening Options Handbook available for download from the from the TT electronics Semelab web site. ESA Quality Level Products are based on the testing procedures specified in the generic ESCC 5000 and in the corresponding part detail specifications. Semelab's QR216 and QR217 processing specifications (JQRS), in conjunction with the companies ISO 9001:2000 approval present a viable alternative to the American MILPRF-19500 space level processing. QR217 (Space Level Quality Conformance) is based on the quality conformance inspection requirements of MIL-PRF19500 groups A (table V), B (table VIa), C (table VII) and also ESA / ESCC 5000 (chart F4) lot validation tests. QR216 (Space Level Screening) is based on the screening requirements of MIL-PRF-19500 (table IV) and also ESA /ESCC 5000 (chart F3). JQRS parts are processed to the device data sheet and screened to QR216 with conformance testing to Q217 groups A and B in accordance with MIL-STD-750 methods and procedures. Additional conformance options are available, for example Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs. These are chargeable and must be specified at the order stage (See Ordering Information). Minimum order quantities may apply. Alternative or additional customer specific conformance or screening requirements would be considered. Contact Semelab sales with enquires.
ORDERING INFORMATION
Part numbers are built up from Type, Package Variant, and screening level. The part numbers are extended to include the additional options as shown below. Type - See Main Part Number Package Variant - See Mechanical Data Screening Level - See Screening Options (ESA / JQRS) Additional Options:
Customer Pre-Cap Visual Inspection Customer Buy-Off visit Data Pack Solderability Samples Scanning Electron Microscopy Radiography (X-ray) Total Dose Radiation Test MIL-PRF-19500 (QR217) Group B charge Group B destructive mechanical samples Group C charge Group C destructive electrical samples Group C destructive mechanical samples ESA/ESCC Lot Validation Testing (subgroup 1) charge LVT1 destructive samples (environmental) LVT1 destructive samples (mechanical) Lot Validation Testing (subgroup 2) charge LVT2 endurance samples (electrical) Lot Validation Testing (subgroup 3) charge LVT3 destructive samples (mechanical) .CVP .CVB .DA .SS .SEM .XRAY .RAD .GRPB .GBDM (12 pieces) .GRPC .GCDE (12 pieces) .GCDM (6 pieces) .LVT1 .L1DE (15 pieces) .L1DM (15 pieces) .LVT2 .L2D (15 pieces) .LVT3 .L3D (5 pieces)
Additional Option Notes: 1) All `Additional Options' are chargeable and must be specified at order stage. 2) When Group B,C or LVT is required, additional electrical and mechanical destructive samples must be ordered 3) All destructive samples are marked the same as other production parts unless otherwise requested.
MARKING DETAILS
Parts can be laser marked with approximately 7 characters on two lines and always includes cathode identification. Typical marking would include part or specification number, week of seal or serial number subject to available space and legibility. Customer specific marking requirements can be arranged at the time of order. Example Marking:
Example ordering information: The following example is for the 1N6626D3A / 1N6626D3B part with package variant A, JQRS screening, additional Group C conformance testing and a Data pack. Part Numbers: 1N6626D3A-JQRS (Include quantity for flight parts) 1N6626D3A.GRPC (chargeable conformance option) 1N6626D3A.GCDE (charge for destructive parts) 1N6626D3A.GCDM (charge for destructive parts) 1N6626D3A.DA (charge for Data pack) Customers with any specific requirements (e.g. marking or screening) may be supplied with a similar alternative part number (there is maximum 20 character limit to part numbers). Contact Semelab sales with enquiries.
1N6626 001
High Reliability and Screening Options Handbook link: http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf
Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Limited Telephone +44 (0) 1455 556565 Fax +44 (0) 1455 552612 Email: sales@semelab-tt.com
Website: http://www.semelab-tt.com
Document Number 8975 Issue 2 Page 4 of 4

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